XC3S250E-4PQG208C芯片解密特性的介绍 - 专业芯片解密服务商

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XC3S250E-4PQG208C芯片解密特性的介绍

  深圳龙人科技有限公司拥有高超的芯片解密、ic解密、单片机破解等的技术和真诚科学的解密服务,为广大客户提供低成本的解密方案与服务。下面是XC3S250E-4PQG208C芯片解密特性的介绍,仅供参考。
  Features
  · Very low cost, high-performance logic solution for high-volume, consumer-oriented applications
  · Proven advanced 90-nanometer process technology
  · Multi-voltage, multi-standard SelectIO(TM) interface pins
     - Up to 376 I/O pins or 156 differential signal pairs
     - LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
     - True LVDS, RSDS, mini-LVDS differential I/O
     - 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
     - Enhanced Double Data Rate (DDR) support
  · Abundant, flexible logic resources
     - Densities up to 33,192 logic cells, including optional shift register or distributed RAM support
     - Efficient wide multiplexers, wide logic
     - Fast look-ahead carry logic
     - Enhanced 18 x 18 multipliers with optional pipeline
     - IEEE 1149.1/1532 JTAG programming/debug port
  · Hierarchical SelectRAM(TM) memory architecture
     - Up to 648 Kbits of fast block RAM
     - Up to 231 Kbits of efficient distributed RAM
  · Up to eight Digital Clock Managers (DCMs)
     - Clock skew elimination (delay locked loop)
     - Frequency synthesis, multiplication, division
     - High-resolution phase shifting
     - Wide frequency range (5 MHz to over 300 MHz)
  · Eight global clocks and eight clocks for each half of device, plus abundant low-skew routing
  · Configuration interface to industry-standard PROMs
     - Low-cost, space-saving SPI serial Flash PROM
     - x8 or x8/x16 parallel NOR Flash PROM
     - Low-cost Xilinx Platform Flash with JTAG
  · Complete Xilinx ISE(TM), WebPACK(TM) development system support
  · MicroBlazeTM, PicoBlazeTM embedded processor cores
  · Fully compliant 32-/64-bit 33/66 MHz PCI support
  · Low-cost QFP and BGA packaging options
     - Common footprints support easy density migration
     - Pb-free packaging options
  更多详情了解咨询请访问官网:http://www.fbjttz.com

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